• 360°infinition rotation in 2 axes with gimbal system
• Accuracy: ±5 arcsec to ±40 arcsec
• Max. load: 6.8-16 Kg
• Hollow aperture: 95-206 mm
• Rotation velocity up to 100rpm

• X, Z, T axes
• 360° infinition rotation
• X-axis travel: 155 mm
• Vertical mechanical travel up to 30mm
• Bidirectional repeatability: ±0.5μm (X-axis); ±0.2μm/1mm (Z-axis); ±2 arcsec (T-axis)
• Maglev gravity compensation technology
• Active air/water cooling design
• Rotation velocity up to 150rpm

• X, Y, T axes
• 360° infinition rotation
• X and Y axis travel: 365 mm
• Bidirectional repeatability: ±0.5μm (X, Y axis); ±2 arcsec (T axis)
• Rotation velocity up to 150rpm

• Stacked 3-axis stage with orthogonality design
• X and Y axis travel: 350 mm
• Bidirectional repeatability: ±1μm (X, Y axis) ±1μm & ±0.3μm/1 mm (Z-axis)
• Max. load: 5 Kg
• Vertical mechanical travel up to 30mm

X/Y axis

• Travel: 350 mm
• Bidirectional repeatability: ±0.5μm
• Consistent design of cable disturbing force

Z-axis

• Bidirectional repeatability:±0.2μm
• Vertical magnetic levitation gravity compensation for high positioning accuracy
• Vertical incremental encoder for up to 5nm resolution
• Ultra-thin, lightweight design
• Vertical mechanical travel up to 30mm

T-axis

• Bidirectional repeatability:±2 arcsec
• 360°rotation, no tubing wrapping, 12', 8' wafer applicable
• Wafer warpage up to 0.7mm
• Rotation velocity up to 150rpm

X/Y axis

• High stiffness, high precision guide
• Consistent design of cable disturbing force

Z-axis

• High stiffness, high precision guide
• Ultra-thin, lightweight and modularization design.

T-axis

• 360°rotation, no tubing wrapping
• 12', 8', 6' wafer applicable
• Rotation velocity up to 150rpm