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Multi-Axis Stage
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L4S210 Stacked XYZT Stage
L4S210 Stacked XYZT Stage
L4S210 Stacked XYZT Stage
Features

  • Stacked 4-axis stage with orthogonality design
  • Global flatness and straightness up to to sub-μm level

X/Y axis

  • High stiffness, high precision guide
  • Consistent design of cable disturbing force

Z-axis

  • Vertical magnetic levitation gravity compensation for high positioning accuracy
  • High stiffness, high precision guide
  • Vertical incremental encoder for up to 5nm resolution
  • Ultra-thin, lightweight design
  • Vertical mechanical travel up to 30mm

T-axis

  • 360°rotation, no tubing wrapping, 12', 8' wafer applicable
  • Wafer warpage up to 0.7mm
  • Rotation velocity up to 150rpm

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Applications

Wafer production control applications

such as: thin film metrology, critical dimension metrology, Wafer scribing, Wafer laser thermal annealing

Description

The stage adopts modularization, ultra-thin, orthogonality design to integrate the MZT90 standard module on the cross platform L2S125 for high-precision, high-stiffness motion of X, Y, Z and T axes with 4 degrees of freedom.

The MZT90 adopts innovative dual-axis coupling design with extremely compact profile. High precision, high stiffness motion with 2 degrees of freedom in vertical and rotary axes.

The L2S125 adopts integration, orthogonality design with a compact, low-profile. High-precision, high-stiffness linear motion in horizontal X/Y axis with 2 degrees of freedom.

Interface Definition

*Interface dimensions from L4S210 in the middle stroke

Technical Specifications
<<<Swipe left to see more parameters

Item

Unit

L4S210-350

Axes name

 

X

Y

Z

T

Travel range

 

350 mm

350 mm

10 mm

360°,Infinite

Max. velocity

 

1 m/s

1 m/s

0.1 m/s

900°/s

Max. acceleration

 

10 m/s²

10 m/s²

2 m/s²

6280°/s²

Accuracy_indicative value

 

±10 μm

±10 μm

 

 

Accuracy_calibration value

 

±1 μm

±1 μm

0.03 μm

±3 arcsec

Bidirectional repeatability

 

±0.5 μm

±0.5 μm

±0.2 μm

±2 arcsec

Position stability(3σ)

 

±2 nm*

±2 nm*

±15 nm*

±0.072 arcsec

Straightness

 

±2 μm over range

±2 μm over range

1μm

 

Pitch

 

±5 arcsec

±5 arcsec

 

 

Roll

 

±5 arcsec

±5 arcsec

 

 

Yaw

 

±10 arcsec

±10 arcsec

 

 

Orthogonality

 

±15 arcsec

±15 arcsec

 

 

Axial & Radial runout

 

NA

NA

NA

±2 μm

Mechanical specifications

 

 

 

 

 

Moving mass (without payload)

 

27 Kg

45 Kg

7 Kg

0.00336 Kg.m²

Max. load

Kg

2 (customizable)

 

 

 

Stage mass

Kg

40 Aluminum alloy

 

 

Dimensions

mm×mm×mm

752×606×209.1 (middle of stroke)

 

 

*Technical data specified with 8μm pitch encoder and under active vibration isolation environment.

Customization Information

The series is configured with options that can be selected based on the user's actual application. Options include encoders, Coarse Z strokes, and more.

 

Table 1 Encoder Options

-S1

Incremental analog optical linear encoder,1Vpp

-S2

Incremental digital optical linear encoder, TTL

-S3

Absolute optical linear encoder, BISS

Table 2 Vertical guide Options

-G1

High-precision air-bearing guide with a vertical mechanical stroke of 6mm

-G2

High-precision cross roller guide with a vertical mechanical stroke of 24mm

-G3

High-precision anti-creep cross roller guide with vertical mechanical travel of 13mm

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