YiNGUAN specializes in high-precision motion systems that supply key components to the semiconductor and LCD industries. The product portfolio includes precision motion systems, advanced piezoelectric actuators, specialty motors, high-precision motion drivers and controllers.
YiNGUAN is characterized by customer demandoriented and rapid response. Professional customization, full life cycle service is the company's adhering to thedevelopment concept.
Becoming the hidden champion enterprise of precision motion systems and core components in semiconductor and high-end equipment.
More precise, More reliable.
Advanced packaging is a concept derived from advanced wafer processes, generally refers to packaging technology that integrates different systems into the same package to achieve more efficient system performance.
In the first half of 2024, the global semiconductor industry shows signs of recovery. With the rapid development of AI and HPC, the requirements for chip performance and power consumption are continuously increasing. Chiplet and 2.5D/3D technologies are d
The wafer dicing equipment is a critical piece of equipment in the semiconductor back-end packaging and testing process, particularly for wafer dicing and WLP (wafer-level packaging) dicing. A single wafer usually comprises hundreds or even thousands of c
Hybrid bonding is the core path to achieve high-density stacking. With the improvement of vertical interconnection of multiple chips driven by high performance computing, the traditional micro-bump technology is faced with solder electromigration, thermal
In semiconductor manufacturing, the thickness of the wafer film has an important impact on the performance and quality of the device.
The definition of overlay error is the plane distance between the centers of two layers of graphic structures.
