Semiconductor - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Advanced Packaging Hybrid Bonding Equipment Motion System

Hybrid bonding is the core path to achieve high-density stacking. With the improvement of vertical interconnection of multiple chips driven by high performance computing, the traditional micro-bump technology is faced with solder electromigration, thermal

Film Thickness (THK) Metrology motion systems

In semiconductor manufacturing, the thickness of the wafer film has an important impact on the performance and quality of the device.

Chip manufacturing Packaging equipment Quantity

Overlay Metrology motion systems

The definition of overlay error is the plane distance between the centers of two layers of graphic structures.

Chip manufacturing Packaging equipment Quantity

Automatic Optic Inspection (AOI) motion systems

With the rapid development of the semiconductor industry, the manufacturing process of semiconductor has been becoming more and more complex, especially with the gradual improvement of the 5nm process and the continuous breakthroughs of the 3nm process.

Chip manufacturing Packaging equipment Quantity

E-beam Lithography (EBL) motion systems

E-beam lithography (e-beam lithography; EBL) begin in the 1960s. It’s a kind of maskless lithography developed on the basis of electron microscopes for microcircuit research and manufacturing.

Electron beam high vacuum precision motion laser interferometer

E-Beam Inspection (EBI) motion systems

Due to the various limitations of optical technology, electron beam imaging techniques have become indispensable as alternatives in advanced semiconductor processes.

Vacuum Electron beam Precision motion Quantity