APPLICATIONS - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Piezoelectric Ceramic for Haptic Feedback Actuators: Technological Innovation Driving the Future of

The rapid development of fields like smart terminals, virtual/augmented reality (VR/AR), automotive electronics, and medical devices has positioned haptic feedback technology as a core driver for upgrading human-machine interaction experiences.

Piezoelectric Ceramic for Ion Trap Electrode Control: Core Components Enabling High-Precision Quantu

Ion Trap technology is a leading approach in quantum computing, favored by major players like Honeywell and IonQ for its advantages including long coherence times and high-fidelity quantum gate operations. According to Market Research Future, the global i

Disrupting Tradition! Piezoelectric Ceramic Solutions for Piezoelectric Switching Valves

The global piezoelectric actuator market is projected to exceed $5 billion by 2025 (CAGR 8.2%), with piezoelectric switching valves emerging as a core driver in medical devices, industrial automation, and precision instrumentation!【Disrupting Tradition! P

Advanced Packaging Wafer Die Bonder Motion System

Advanced packaging is a concept derived from advanced wafer processes, generally refers to packaging technology that integrates different systems into the same package to achieve more efficient system performance.

Advanced Packaging Wafer Thinning Equipment Motion System

In the first half of 2024, the global semiconductor industry shows signs of recovery. With the rapid development of AI and HPC, the requirements for chip performance and power consumption are continuously increasing. Chiplet and 2.5D/3D technologies are d

Advanced Packaging Wafer Dicing equipment Motion System

The wafer dicing equipment is a critical piece of equipment in the semiconductor back-end packaging and testing process, particularly for wafer dicing and WLP (wafer-level packaging) dicing. A single wafer usually comprises hundreds or even thousands of c