Electrostatic chuck (ESC) is a silicon wafer clamping tool used in semiconductor processes. Based on the principle of electrostatic adhesion, ESC applies external high voltage to generate Coulomb adhesion force or J-R adhesion force to clamp the silicon wafer.
General dimension,Unit:mm
|
Item |
Unit |
6inch ESC |
8inch ESC |
12inch ESC |
|
Electrostatic type |
|
Coulombic or Gradient |
Coulombic or Gradient |
Coulombic or Gradient |
|
Number of electrodes |
|
Bi-polar |
Bi-polar |
Bi-polar |
|
Accuracy |
|
|
|
|
|
Global flatness |
μm |
＜1 |
＜1 |
＜2 |
|
Parallelism |
μm |
＜5 |
＜5 |
＜5 |
|
Electrical properties |
|
|
|
|
|
Standard clamping voltage |
V |
1000 |
1000 |
1000 |
|
Leakage current |
nA |
＜5 |
＜5 |
＜5 |
|
Performance parameter |
|
|
|
|
|
Clamping force |
N |
≥10 (Coulomb) |
≥16(Coulomb) |
≥40(Coulomb) |
|
Dimensions |
|
|
|
|
|
Diameter |
mm |
144 |
194 |
294 |
|
Thickness |
mm |
12.6 |
12.6 |
12.6 |
*Customized requirements accepted
