Electrostatic Chuck - Electrostatic Chuck&Controller - Shanghai YiNGUAN Semiconductor Technology Co., LTD

Coulomb's Law or Gradient Force electrostatic chuck
Support Bi-polar, multi-polar electrode, interdigitated electrode design etc.
Suitable for UHV environments up to 10^-5 Pa
High clamping force
Typical global flatness: 2μm PV (D = 300 mm)
Flexible surface pattern design
Suitable for non-magnetic environment
Adsorption objects include wafer, dielectric material such as sapphire, glass and more.

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Applications

Wafer Metrology: EBI, CD-SEM, Review-SEM
Wafer Fabrication: E-Beam Lithography
Thin Film Deposition (CVD, PVD etc.)
Ion Implanter etc.

Description

Electrostatic chuck (ESC) is a silicon wafer clamping tool used in semiconductor processes. Based on the principle of electrostatic adhesion, ESC applies external high voltage to generate Coulomb adhesion force or J-R adhesion force to clamp the silicon wafer.

Interface Definition

General dimension,Unit:mm

Technical Specifications

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Item	Unit	6inch ESC	8inch ESC	12inch ESC
Electrostatic type		Coulombic or Gradient	Coulombic or Gradient	Coulombic or Gradient
Number of electrodes		Bi-polar	Bi-polar	Bi-polar
Accuracy
Global flatness	μm	＜1	＜1	＜2
Parallelism	μm	＜5	＜5	＜5
Electrical properties
Standard clamping voltage	V	1000	1000	1000
Leakage current	nA	＜5	＜5	＜5
Performance parameter
Clamping force	N	≥10 (Coulomb)	≥16(Coulomb)	≥40(Coulomb)
Dimensions
Diameter	mm	144	194	294
Thickness	mm	12.6	12.6	12.6