Semiconductor lithography equipment
Semiconductor inspection equipment, such as film thickness measurement, OCD measurement, morphology measurement, defect inspection, etc.
This chuck adopts lightweight design, and is made of materials with low coefficients of thermal expansion: pressureless sintered silicon carbide, silicon carbide, silicon nitride and aluminum nitride.
This chuck features high stiffness, high thermal conductivity, low thermal expansion, high stability, high purity, uniform grain size, etc., which effectively reduces contamination from Particle and chemical cleaning and extends service lifetime.
|
Item |
Data |
|
|
Flatness |
μm |
0.5 |
|
Applicable specifications |
|
6/8' 12' 8/12' |
|
Surface feature |
|
pin type，ring type |
|
Pin height |
mm |
0.05-0.2 |
|
Pin min. diameter |
mm |
φ0.2 |
|
Min. spacing |
mm |
3 |
|
Min. seal width |
mm |
0.7 |
|
Surface roughness |
μm |
Ra 0.02 |
|
Thickness tolerance |
mm |
±0.01 |
|
Diameter tolerance |
mm |
±0.01 |
|
Parallelism tolerance |
μm |
≤3 |
